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isolation voltage 2500vrms 1ch gate driver providing galvanic i solation bm6105f w- lb z general description this is the product guarantees long time support in industrial market. the bm610 5 is a gate driver with isolation voltage 2500vrms, i/o delay time of 12 0ns, and minimum input pulse width of 60 ns, and incorporates the fault signal output functions, undervoltage lockout (uvlo) function, and desaturation protection (desat) function. features ? long t ime s upport p roduct for industrial a pplications. ? provi ding galvanic isolation ? miller clamp function ? fault signal output function ? ready signal output function ? undervoltage lockout function ? desaturation protection function ? supporting negative vee2 applications ? driving igbt gate for industrial equipment ? driving mosfet gate for industrial equipment key specification s ? isolation voltage: 2500 v rms ? maximum gate drive voltage : 20 v ? i/o delay time : 95ns ( max. ) ? minimum input pulse width: 60 ns (max .) package w( typ ) x d (typ) x h (max) sop16wm 10.34 mm x 10.31 mm x 2.64 mm typical application circ uit fig ure 1. typical application circuit vee2 clamp out vcc2 nc gnd2 des at vee2 1pin logic 9v - + 2v (vee2) - + uvlo rdy flt s q r vcc1 xrst flt rdy inb ina uvlo gnd1 gnd1 logic product structure silicon integrated circuit this product is not designed protection against radioactive rays . 1/ 27 tsz02201 - 0818abh00020 -1-2 ? 2014 rohm co., ltd. all rights reserved. 07.nov.2014 rev.002 tsz22111 ? 14 ? 001 www.rohm.com downloaded from: http:///
b m6105fw - lbz recommended range of external constants pin name symbol recommended value unit min typ max vcc1 c vcc1 0.1 1.0 - f vcc2 c vcc2 0.33 - - f pi n configuration s fig ure 2. pin configuration pin descriptio ns pin no. pin name function 1 vee2 output - side negative power supply pin 2 desat desaturation protection pin 3 gnd2 output - side ground pin 4 nc no connect 5 vcc 2 output - side positive power supply pin 6 out output pin 7 clamp miller clamp pin 8 vee2 output - side negative power supply pin 9 gnd1 input - side ground pin 10 ina control input pin a 11 inb control input pin b 12 rdy ready output pin 13 flt fault o utput pin 14 x rst reset input pin 15 vcc1 input - side power supply pin 16 gnd1 input - side ground pin vee2 des at gnd2 nc vcc2 out clamp vee2 gnd1 vcc1 xrst flt rdy inb ina gnd1 2/ 27 tsz02201 - 0818abh00020 -1-2 ? 2014 rohm co., ltd. all rights reserved. 07.nov.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m6105fw - lbz absolute maximum ratings (note1) relative to gnd1. (note2) relative to gnd2. (note3) should not exceed pd and tj=1 50 c. (note4) derate above ta=25 c at a rate of 9. 6 mw/ c. mounted on a glass epoxy of 114.3 mm 7 6.2 mm 1.6 mm. caution: operating the ic over the absolute maximum ratings may damage the ic. th e damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circ uit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions parameter symbol min max units input - side supply voltage v cc1 (note5) 4.5 5.5 v output - side positive supply voltage v cc2 (note6) 1 3.3 20.0 v output - side negative supply voltage v ee2 (note6) - 12 0 v maximum difference between output - side positive and negative volta ges v max2 - 28.0 v (note5) relative to gnd1. (note6) relative to gnd2. insulation r elated c haracteristics parameter symbol characteristic units insulation resistance (v io =500v) r s >10 9 insulation withstand voltage / 1min v iso 2500 vrms ins ulation test voltage / 1sec v iso 3000 vrms parameter symbol limits unit input - side supply voltage v cc1 - 0.3 to +7.0 (note1) v output - side positive supply voltage v cc2 - 0.3 to +24.0 (note2) v output - side negative supply voltage v ee2 - 15.0 to +0.3 (note3) v maximum difference between output - side positive and negative voltages v max2 30.0 v ina, inb, xrst pin input voltage v in - 0.3 to +vcc1+0.3 or 7.0 (note1) v r d y, f lt p i n input voltage v flt - 0.3 to +vcc1+0.3 or 7.0 (note1) v desat pin input voltage v desatin - 0.3 to vcc2+0.3 (note2) v out pin output current (10 s) i outpeak 5.0 a out, clamp pin voltage v out vee2- 0.3v to vcc2+0.3v v rdy, flt output current i flt 10 ma powe r dissipation p d 1.20 (note4) w operating temperature range t opr - 40 to +105 c storage temperature range t stg - 55 to +150 c junction temperature t jmax +150 c 3/ 27 tsz02201 - 0818abh00020 -1-2 ? 2014 rohm co., ltd. all rights reserved. 07.nov.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m6105fw - lbz electrical characteristics unless otherwise specified t a =- 40 c to 105 c , v cc1 =4.5v to 5.5v, v cc2 =1 3.3 v to 20v, v ee2 =- 12v to 0v parameter symbol min typ max unit conditions general input side circuit curre nt 1 i cc11 0.16 0.32 0.48 ma input side circuit current 2 i cc12 0.21 0.42 0.63 ma ina=10khz, duty=50% input side circuit current 3 i cc13 0.26 0.52 0.78 ma ina=20khz, duty=50% output side circuit current 1 i cc21 0.9 1.8 2. 7 ma out=l output side circuit current 2 i cc22 0.8 1.7 2.5 ma out=h logic block logic high level input voltage v inh 2.0 - v cc1 v ina, inb, xrst logic low level input voltage v inl 0 - 0.8 v ina, inb, xrst logic pull - down resistance r ind 25 50 100 k ina logic pull - up resistance r inu 25 50 100 k inb, xrst, rdy, flt logic input mask time t inmsk - - 60 ns ina, inb minimum xrst pulse width t xrstmin 800 - - ns output out on resistance (source) r onh 0.3 0.8 1.5 i out =40ma out on resistance (sink) r onl 0.2 0. 5 0. 9 i out =40ma out maximum current i outmax 3.0 4.5 - a guaranteed by design clamp on resistance r on clp 0.2 0.5 0.9 i clamp =40ma low level clamp current i clampl 3.0 4.5 - a guaranteed by design turn on time t pon 45 70 95 ns turn off ti me t poff 45 70 95 ns propagation distortion t pdist - 20 0 20 ns t poff - t pon rise time t rise - 50 100 ns 10 , 10nf between out -vee2 guaranteed by design fall time t fall - 50 100 ns clamp on threshold voltage v clpon 1.8 2 2.2 v relative to vee2 common mode transient immunity cm 100 - - kv/s guaranteed by design 4/ 27 tsz02201 - 0818abh00020 -1-2 ? 2014 rohm co., ltd. all rights reserved. 07.nov.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m6105fw - lbz electrical characteristics - continued unless otherwise specified t a =- 40 c to 105 c , v cc1 =4.5v to 5.5v, v cc2 =1 3.3 v to 20v, v ee2 =- 12v to 0v parameter symbol min typ max unit conditions protection functions vcc1 uvlo off voltage v uvlo1h 3.35 3.50 3.65 v vcc1 uvlo on voltage v uvlo1l 3.25 3.40 3.55 v vcc1 uvlo mask time t uvlo1msk 1.0 2.5 5.0 s vcc2 uvlo off voltage v uvlo2h 11.3 12.3 13.3 v vcc2 uvlo on voltage v uvlo2l 10.3 11.3 12.3 v vcc2 uvlo mask time t uvlo2ms k 1.0 2.0 3.0 s desat source current i desat 450 500 550 a desat threshold voltage v desat 8.5 9.0 9.5 v desat filter time t desatfil 0.16 0.25 0.34 s desat delay time (out) t desatout 0.31 0.38 0.45 s desat delay time (flt) t desatflt 0.34 0.42 0 .50 s desat low voltage v desatl - 0.1 0.22 v i desat =1ma leading edge blanking t desatleb 0.28 0.4 0.52 s guaranteed by design rdy output low voltage v rdyl - 0.08 0.15 v i rdy =5ma flt output low voltage v fltl - 0.08 0.15 v i flt =5ma 5/ 27 tsz02201 - 0818abh00020 -1-2 ? 2014 rohm co., ltd. all rights reserved. 07.nov.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m6105fw - lbz t ypical performa nce curves 0.21 0.31 0.41 0.51 0.61 4.5 4.75 5 5.25 5.5 i c c1 [ma ] v cc1 [v] 0.21 0.31 0.41 0.51 0.61 -40 -20 0 20 40 60 80 100 i cc1 [ma ] ta[ c] figure 3. input side circuit current 1 figure 4. input side circuit current 1 figure 5. input side circuit current 2 ( ina=10khz, duty=50% ) figure 6. input side circuit current 2 ( ina=10khz, duty= 50% ) 0.16 0.24 0.32 0.40 0.48 4.5 4.75 5 5.25 5.5 i cc1 [ma] v cc1 [v] 0.16 0.24 0.32 0.40 0.48 -40 -20 0 20 40 60 80 100 i cc1 [ma ] ta[ c] - 40 c 25 c 105c v cc1 =5.5v v cc1 =5v v cc1 =4.5v - 40 c 25 c 105c v cc1 =5.5v v cc1 =5v v cc1 =4.5v 6/ 27 tsz02201 - 0818abh00020 -1-2 ? 2014 rohm co., ltd. all rights reserved. 07.nov.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m6105fw - lbz t ypical performance curves - continued figure 7. input side circuit current 3 ( ina=20khz, duty=50% ) figure 8. input s ide circuit current 3 ( ina=20khz, duty=50% ) figure 9. output side circuit current 1 (v ee2 =0v, out=l ) figure 1 0. output side circuit current 1 (v ee2 =0v, out=l ) 0.26 0.36 0.46 0.56 0.66 0.76 -40 -20 0 20 40 60 80 100 i cc1 [ma] ta[ c] 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 2.5 2.7 13.3 15.3 17.3 19.3 i cc21 [ma] v cc2 [v] 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 2.5 2.7 -40 -20 0 20 40 60 80 100 i cc21 [ma ] ta[ c] - 40 c 25 c 105c v cc1 =5.5v v cc1 =5v v cc1 =4.5v - 40 c 25 c 105c v cc2 =20v v cc2 =15v v cc 2 =13.3v 7/ 27 tsz02201 - 0818abh00020 -1-2 ? 2014 rohm co., ltd. all rights reserved. 07.nov.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 0.26 0.36 0.46 0.56 0.66 0.76 4.5 4.75 5 5.25 5.5 i cc1 [ma] vcc1[v] downloaded from: http:///
b m6105fw - lbz t ypic al performance curves - continued figure 11. output side circuit cur rent 1 (v ee2 =- 8v, out=l ) figure 12. output side circuit current 1 (v ee2 =- 8v, out=l ) figure 13. output side circuit current 1 (v ee2 =- 12v, out=l ) figure 1 4. output side circuit current 1 (v ee2 =- 12v, out=l ) 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 2.5 2.7 -40 -20 0 20 40 60 80 100 i cc21 [ma] ta[ c] 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 2.5 2.7 13.3 13.8 14.3 14.8 15.3 15.8 i cc21 [ma] v cc2 [v] 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 2.5 2.7 -40 -20 0 20 40 60 80 100 i c c21 [ma ] ta[ c] - 40 c 25 c 105c v cc 2 =15v v cc 2 =13.3v v cc2 =20v - 40 c 25 c 105c v cc2 =16v v cc2 =15v v cc 2 =13.3v 8/ 27 tsz02201 - 0818abh00020 -1-2 ? 2014 rohm co., ltd. all rights reserved. 07.nov.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 2.5 2.7 13.3 15.3 17.3 19.3 i cc21 [ma] v cc2 [v] downloaded from: http:///
b m6105fw - lbz t ypical performance curves - continued fi gure 1 5. output side circuit current 2 (v ee2 =0v, out= h) figure 16. output side circuit current 2 (v ee2 =0v, out= h) figure 1 7. output side circuit current 2 (v ee2 =- 8v, out= h) figure 1 8. output side circuit current 2 (v ee2 =- 8v, out= h) 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 13.3 15.3 17.3 19.3 i cc22 [v ] v cc1 [v] 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 -40 -20 0 20 40 60 80 100 i cc22 [v ] ta[ c] 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 13.3 15.3 17.3 19.3 i cc22 [ma] v cc2 [v] 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 -40 -20 0 20 40 60 80 100 i cc22 [ma ] ta[ c] - 40 c 25 c 105c v cc2 =20v v cc2 =15v v cc 2 =13.3v 25 c v cc2 =13.3v 105 c - 40 c v cc2 =15v v cc2 =20v 9/ 27 tsz02201 - 0818abh00020 -1-2 ? 2014 rohm co., ltd. all rights reserved. 07.nov.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m6105fw - lbz t ypical performance curves - continued figure 1 9. output side circuit current 2 (v ee2 =- 12v, o ut=h ) figure 20. output side circuit current 2 (v ee2 =- 12v, o ut=h ) figure 21. logic high level input voltage figure 22. l ogic low level input voltage 0.0 1.0 2.0 3.0 4.0 5.0 4.5 4.75 5 5.25 5.5 v inh [v ] v cc1 [v] 0.0 1.0 2.0 3.0 4.0 5.0 4.5 4.75 5 5.25 5.5 v inl [v ] v cc1 [v ] 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 13.3 13.8 14.3 14.8 15.3 15.8 i cc2 [ma] v cc2 [v] 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 -40 -20 0 20 40 60 80 100 i cc2 [ma ] ta[ c] - 40 c 25 c 105c v cc2 =20v v cc2 =15v v cc 2 =13.3v - 40 c 25 c 105 c - 40 c 25 c 105 c 10 / 27 tsz02201 - 0818abh00020 -1-2 ? 2014 rohm co., ltd. all rights reserved. 07.nov.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m6105fw - lbz t ypical performance curves - continued figure 23. logic pull - down resistance figure 24. logic pull - up resistan ce figure 25. logic input mask time figure 26. minimum xrst pulse width 0 10 20 30 40 50 60 4.5 4.75 5 5.25 5.5 t inmsk [ns ] v cc1 [v] 0 100 200 300 400 500 600 700 800 4.5 4.75 5 5.25 5.5 t xrstmin [ns ] v cc1 [v] 25 50 75 100 4.5 4.75 5 5.25 5.5 r ind [k] v cc1 [v] 25 50 75 100 4.5 4.75 5 5.25 5.5 r inu [k] v cc1 [v] - 40 c 25 c 105c - 40 c 25 c 105c 105c 25c - 40 c - 40 c 105 c 25c 11 / 27 tsz02201 - 0818abh00020 -1-2 ? 2014 rohm co., ltd. all rights reserved. 07.nov.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m6105fw - lbz t ypical performance curves - continued figure 27. out on resistance (source) figure 28. out on resistance (sink) figure 2 9. clamp on resistance figure 30. turn on time 45 55 65 75 85 95 13.3 15.3 17.3 19.3 t pon [ns ] v cc2 [v ] 0.3 0.5 0.7 0.9 1.1 1.3 1.5 13.3 15.3 17.3 19.3 r onh [k] v cc2 [v] 0.2 0.4 0.6 0.8 13.3 15.3 17.3 19.3 r onl [k ] v cc2 [v] 0.2 0.4 0.6 0.8 13.3 15.3 17.3 19.3 r onpro [k ] v cc2 [v] 105c 25c - 40 c 105c 25c - 40 c 105c 25c - 40 c 105c 25 c - 40 c 12 / 27 tsz02201 - 0818abh00020 -1-2 ? 2014 rohm co., ltd. all rights reserved. 07.nov.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m6105fw - lbz t ypical performance curves - continued figure 31. turn off time figure 32. propagation distortion figure 33. clamp on threshold voltage figure 34. vcc1 uvlo off voltage 45 55 65 75 85 95 13.3 15.3 17.3 19.3 t poff [ns] v cc2 [v] -20 -10 0 10 20 13.3 15.3 17.3 19.3 t pdist [ns ] v cc2 [v ] 1.8 1.9 2.0 2.1 2.2 13.3 15.3 17.3 19.3 v clpon [v ] v cc2 [v] 3.35 3.45 3.55 3.65 -40 -20 0 20 40 60 80 100 v uvlo1h [v ] ta[ c] 105c -40c 105c 25 c - 40 c - 40 c 25 c 25 c 105c 13 / 27 tsz02201 - 0818abh00020 -1-2 ? 2014 rohm co., ltd. all rights reserved. 07.nov.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m6105fw - lbz t ypical performance curves - continued figure 35. vcc1 uvlo on voltage figure 36. vcc1 uvlo mask time figure 37. vcc2 uvlo off voltage figure 38. vcc2 uvlo on voltage 3.25 3.35 3.45 3.55 -40 -20 0 20 40 60 80 100 v uvlo1l [v] ta[ c] 1 2 3 4 5 -40 -20 0 20 40 60 80 100 v uvlo1msk [ s] ta[ c] 11.3 11.8 12.3 12.8 13.3 -40 -20 0 20 40 60 80 100 v uvlo2h [v ] t a[ c] 10.3 10.8 11.3 11.8 12.3 -40 -20 0 20 40 60 80 100 v uvlo2l [v ] ta[ c] v ee 2 =- 8v v ee2 =- 12v v ee2 =0v v ee2 =0v v ee2 =- 8v v ee2 =- 12v 14 / 27 tsz02201 - 0818abh00020 -1-2 ? 2014 rohm co., ltd. all rights reserved. 07.nov.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m6105fw - lbz t ypical performance curves - continued figure 39. vcc2 uvlo mask time figure 40. desat source current figure 41. desat threshold voltage figure 42. desat filter time 1 1.5 2 2.5 3 -40 -20 0 20 40 60 80 100 t uvlo2msk [s] ta[ c] 450 470 490 510 530 550 13.3 15.3 17.3 19.3 i desat [a] v cc2 [v] 8.5 8.7 8.9 9.1 9.3 9.5 13.3 15.3 17.3 19.3 v desat [v ] v cc2 [v] 0.16 0.18 0.2 0.22 0.24 0.26 0.28 0.3 0.32 0.34 13.3 15.3 17.3 19.3 t desatfil [ s] v cc2 [v] v ee2 =- 12v v ee2 =- 8v v ee2 =0v - 40 c 25 c 10 5c 105 c 25 c - 40 c 105 c - 40 c 25 c 15 / 27 tsz02201 - 0818abh00020 -1-2 ? 2014 rohm co., ltd. all rights reserved. 07.nov.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m6105fw - lbz t ypical performance curves - continued 0 0.04 0.08 0.12 0.16 0.2 13.3 15.3 17.3 19.3 v desatl [v ] v cc2 [v ] 0 0.05 0.1 0.15 4.5 4.75 5 5.25 5.5 v rdyl, v fltl [v] v cc1 [v] 0.31 0.33 0.35 0.37 0.39 0.41 0.43 0.45 13.3 15.3 17.3 19.3 t desatout [s] v cc2 [v] 0.34 0.36 0.38 0.4 0.42 0.44 0.46 0.48 0.5 13.3 15.3 17.3 19.3 t desatflt [s] v cc2 [v ] figure 43. desat delay time (out) figure 44. desat delay time (flt) figure 45. desat low voltage figure 46. rdy output l ow voltage flt output low voltage - 40 c 25 c 105 c - 40 c 25 c 105 c 105 c - 40 c 105 c 25 c - 40 c 25 c 16 / 27 tsz02201 - 0818abh00020 -1-2 ? 2014 rohm co., ltd. all rights reserved. 07.nov.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m6105fw - lbz description of pins and cautions on layout of board 1. vcc1 (input - side power supply pin) the vcc1 pin is a power supply pin on the input side. to suppress voltage fluctuations due to the current to drive internal transformers, connect a bypass capacitor between the vcc1 and the gnd1 pins. 2. gnd1 (input - side ground pin) the gnd1 pin is a ground pin on the input side. 3. vcc2 (output - side positive power supply pin) the vcc2 pin is a positive power supply pin on the output side. to reduc e voltage fluctuations due to out pin output current and due to the current to drive internal transformers, connect a bypass capacitor between the vcc2 and the gnd2 pins. 4. vee2 (output - side negative power supply pin) the vee2 pin is a power supply pin on the output side. to suppress voltage fluctuations due to out pin output current and due to the current to drive internal transformers , connect a bypass capacitor between the vee2 and the gnd2 pins. to use no negative power supply, connect the vee2 pin to the gnd2 pin. 5. gnd2 (output - side ground pin) the gnd2 pin is a ground pin on the output side. connect th e gnd2 pin to the emitter / source of a power device . 6. in a, inb and xrst (control input ter minal) the in a, inb and xrst pin is a pin used to determine output logic. and xrst is in charge of setting back the flt pin. xrst inb ina out l x x l h h x l h l l l h l h h 7. flt (fault output pin) the flt pin is an open drain pin used to output a fault signal when desaturation function is activated , and will be cleared at the rising edge of flt . status flt while in normal operation h when desaturation function is activated l 8. rdy ( ready output pin ) t he rdy pin shows the status of three internal protection features which are vcc1 uvlo, vcc2 uvlo, and outpu t state feedback (osfb). the term output state feedback shows whether output internal logic is high or low corresponds to input logic or not. status rdy while in normal operation h vcc1 uv lo or vcc2 uvlo or output internal logic feedback l 9. out (output pin) the out pin is a pin used to drive the gate of a power device. 10. clamp ( miller clamp pin) the clamp pin is a pin for p reventing increase in gate voltage due to the miller current of th e power device connected to out pin. clamp should be disconnected when miller clamp function is not used. 11 . desat ( desaturation protection pin) the desat pin is a pin used to detect desaturation of igbt/mosfet . when the desat pin voltage exceeds v desat , the desat function will be activated. this may cause the ic to malfunction in an open state. to avoid s uch trouble, short - circuit the desat pin to the gnd2 pin if the desaturation protection is not used. in order to prevent the wrong detection due t o noise, the noise mask time t desatfil is set. 17 / 27 tsz02201 - 0818abh00020 -1-2 ? 2014 rohm co., ltd. all rights reserved. 07.nov.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m6105fw - lbz description of functions and examples of constant setting 1. miller clamp function if out =l and the clamp pin voltage < v clp on , the internal mosfet of the clamp pin turns on . fig ure 47 . timing chart of miller clamp function 2. fault status output this function is used to output a fault signal from the flt pin when the de satura tion protection function is activated and hold the fault signal until rising edge of xrst is put in . 3. undervoltage lockout ( uvlo ) function the bm610 5fw- lbz incorporates the undervoltage lockout (uvlo) function both on the input and the output sides. w hen the power supply voltage drops to the uvlo on voltage, the out pin and the rdy pin both will output the l signal. when the power supply voltage rises to the uvlo off voltage, these pins will be reset. t o prevent malfunctions due to noises, mask time t uvlo1msk and t uvlo2msk are set on both input and output sides . out clamp i nternal mosfet of the clamp pin l l ess than v clpon on l not less than v clp on off h x off in l h vcc2 v uvlo2h v uvlo2l rdy hi -z l out l h hi -z figure 49. output - side uvlo operation timing chart fig ure 48. input - side uvlo function operation timing chart vcc1 v uvlo1h v uvlo1l rdy hi -z l out l h l h in v clpon ina out clamp (monitoring the gate voltage) t poff t pon 18 / 27 tsz02201 - 0818abh00020 -1-2 ? 2014 rohm co., ltd. all rights reserved. 07.nov.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m6105fw - lbz 4. desaturation protection function (desat) when the desat pin voltage exceeds v desat , the desat function will be activated. when the desat function is activated, the out pin voltage will be set to the l level , and then the flt pin voltage to the l level. w hen the rising edge is put in the xrst pin, the desat function will be released. figure 50 . desat operation timing chart 5. i/o condition table no. status input output vcc1 vcc2 d e s a t x r s t i n b i n a c l a m p o u t c l a m p f l t r d y 1 vcc1uvlo uvlo x x x x x h l hi -z h l 2 uvlo x x x x x l l l h l 3 vcc2uvlo uvlo l x x x h l hi -z h l 4 uvlo l x x x l l l h l 5 uvlo h x x x h l hi -z l l 6 uvlo h x x x l l l l l 7 desat h x x x h l hi -z l h(*) 8 h x x x l l l l h(*) 9 xrst l l x x h l hi -z h h(*) 10 l l x x l l l h h(*) 11 normal operation l h h x h l hi -z h h(*) 12 l h h x l l l h h(*) 13 l h l l h l hi -z h h(*) 14 l h l l l l l h h(*) 15 l h l h x h hi -z h h(*) : vcc1 or vcc2 > uvlo, x:don't care (*) if the internal logic of high voltage side doesn t become the expected value , the rdy pin wi ll become l. and this stage is cleared automatically if the internal logic of high voltage side becomes the expected value. xrst desat out in a h l v desat l h h l t desatleb flt h l t d esatfil t d es atout t d esatflt > t xrstmin 19 / 27 tsz02201 - 0818abh00020 -1-2 ? 2014 rohm co., ltd. all rights reserved. 07.nov.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m6105fw - lbz power dissipation fig ure 51 . sop 16 wm derating curve thermal design please confirm that the ic s chip temperature tj is not over 150 c , while considering the ic s power consumption (w), package power (pd) and ambient temperature (ta). when tj=150 c is exceeded the functions as a semiconductor do not operate and some problems (ex. abnormal operation of various parasitic elements and increasing of leak current) occur. constant use under these circumstances leads to deterioration and eventually ic may destruct . tjmax=150 c must be strictly obeyed under all circumstances. 0 0.25 0.5 0.75 1 1.25 1.5 0 25 50 75 100 125 150 175 ambient temperature : ta [ ] power dissiqation : pd [w] measurement machine t3ster menter graphics measurement condition rohm board board size 114.3 76.2 1.6mm 3 1- layer board ja =104.1 /w 20 / 27 tsz02201 - 0818abh00020 -1-2 ? 2014 rohm co., ltd. all rights reserved. 07.nov.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m6105fw - lbz i/o equivalence circuit s pi n no. name i/o equivalence circuit s function 2 desat desaturation protection pin 6 out output pin 7 clamp miller clamp pin vcc2 clamp vee2 vcc2 out vee2 vcc2 des at gnd2 21 / 27 tsz02201 - 0818abh00020 -1-2 ? 2014 rohm co., ltd. all rights reserved. 07.nov.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m6105fw - lbz pin no. name i/o equivalence circuit s function 10 ina control input pin 11 inb opposite drivers control input pin 14 xrst reset input pin 12 rdy ready output pin 13 flt fault output pin vcc1 rdy/ flt gnd1 vcc1 gnd1 ina/ vcc1 gnd1 ina/ 22 / 27 tsz02201 - 0818abh00020 -1-2 ? 2014 rohm co., ltd. all rights reserved. 07.nov.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m6105fw - lbz operational notes 1. reverse c onnection of p ower s upply connecting the power supply in reverse polarity can damage the ic. take pr ecautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic s power supply pin s. 2. power s upply l ines design the pcb layout pattern to provide low impedance supply lines. s eparate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affe cting the analog block . furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. g round voltage ensur e that no pins of input side (9pin to 16pin) are at a voltage below that of the gnd1 pin at any time, even during transient condition. ensure that no pins of output side (1pin to 8pin) are at a voltage below that of the vee2 pin at any time, even during tr ansient condition. 4. g round w iring pattern when using both small - signal and large - current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small - signal ground caused by large currents. also ensure that the ground traces of external components do not cause variat ions on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedanc e. 5. thermal c onsi deration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended o perating c onditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the conditions of each parameter . 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may b e unstable and inrush current may flow instantaneously due to the internal powering sequence and delay s, especially if the ic has more than one power supply. therefore, give special consideration to power coupli ng capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation u nder s trong e lectromagnetic f ield operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction . 9. testing on a pplication b oards when testing the ic on an application boar d, connecting a capacitor directly to a low - impedance output pin may subject the ic to stress. always discharge capacitors completely after each pr ocess or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the i nspection process. to prevent damage from static discharge, ground the ic during ass embly and use similar precautions during transport and storage. 10. inter- pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply a nd output pin . inter - pin shorts could be due to many reasons such as metal part icles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 23 / 27 tsz02201 - 0818abh00020 -1-2 ? 2014 rohm co., ltd. all rights reserved. 07.nov.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m6105fw - lbz operational notes C continued 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high imp edance and extremely low capacitance. if left unconnected, the electric field from the outside can easi ly charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through th e transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. regarding the i nput p in of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p - n junctions are formed at the intersection of the p layers with the n layers of other elements, cr eating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p - n junction operates as a parasitic diode. when gnd > pin b, the p - n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in m utual interference among circuits, operational faults, or physical damage. therefore , conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p subst rate) should be avoided. f ig ure 52 . example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the chan ge of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements 24 / 27 tsz02201 - 0818abh00020 -1-2 ? 2014 rohm co., ltd. all rights reserved. 07.nov.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m6105fw - lbz or dering informatio n b m 6 1 0 5 f w - l b z e 2 part number package fw:sop16wm product class lb for industrial applications packaging and forming specification e2: embossed tape and reel marking diagr am (top view) sop16wm ( top view) bm6105 part number marking lot number 1pin mark 25 / 27 tsz02201 - 0818abh00020 -1-2 ? 2014 rohm co., ltd. all rights reserved. 07.nov.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m6105fw - lbz physical dimension tape and reel information package name sop16wm unit(mm) 26 / 27 tsz02201 - 0818abh00020 -1-2 ? 2014 rohm co., ltd. all rights reserved. 07.nov.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
b m6105fw - lbz revision history date revision changes 22 .sep .201 4 001 new release 07. nov.2014 0 02 page 4 : add common mode transient immunity 27 / 27 tsz02201 - 0818abh00020 -1-2 ? 2014 rohm co., ltd. all rights reserved. 07.nov.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
notice C ss rev.003 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extreme ly high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in advance. unless otherwise agreed in writin g by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific applic ations japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to s trict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequ ate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extraordinary environments or conditions, as exemplified bel ow . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under any special or extraordinary environments or conditions. if you intend to use our pr oducts under any special or extraordinary environments or c onditions (as exemplified below), your independent verification and confirmation of product performance, reliabil ity, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using wate r or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mo unted products in using the products. 6. in particular, if a transient load (a large amount of load a pplied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommend ed. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7. de -rate power dissipation (pd) depending on ambient temperature (ta). wh en used in sealed area, confirm the actual ambient temperature. 8. confirm that operation temperature is within the specified range d escribed in the product specification. 9. rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, e tc.) flux is used, the residue of flux may negatively affect p roduct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mu st be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts, please consult with t he rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice C ss rev.003 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin co nsidering variations of the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contained in this docu ment are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensatio n [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderab ility of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is ind icated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label qr code printed on rohm products label is for rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under controlled goods prescr ibed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. al l information and data including but not limited to applic ation example contained in this document is for reference only. rohm does not warrant that foregoing information or da ta will not infringe any intellectual property rights or any other rights of a ny third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or other d amages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any i ntellectual property rights or other rights of rohm or any third parties with respect to the information contained in this d ocument. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modifie d, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the products and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described i n this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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